Universal Magnetic Tin Planting Pad High-temperature Resistant Insulating Silicone Pad for Mobile Phone BGA CPU IC Chips Reballing Soldering Repair（Magnetic Base And Planting Tin Mat）,2.36*3.15 inch
Disponible.
Precio:
Q404.00
Garantía:
Verifica las políticas de Tienda Mundial
Elegible para
cuotas.
Ingresa el número de tu tarjeta en los detalles de pago para ver el monto total a pagar.
| Cuotas | Monto |
| 3 (Sin recargo) | Q134.67 |
| 6 (Sin recargo) | Q67.33 |
| 10 | Q42.82 |
| 12 | Q36.02 |
| 15 | Q28.95 |
| 18 | Q24.35 |
| 24 | Q18.94 |
| 36 | Q12.74 |
| 48 | Q9.64 |
| Cuotas | Monto |
| 3 (Sin recargo) | Q134.67 |
| 6 (Sin recargo) | Q67.33 |
| 10 (Sin recargo) | Q40.40 |
| 12 (Sin recargo) | Q33.67 |
| 15 | Q28.82 |
| 18 | Q24.02 |
| 24 | Q18.14 |
| 36 | Q12.48 |
| Cuotas | Monto |
| 3 | Q142.41 |
| 6 | Q72.05 |
| 10 | Q43.33 |
| 12 | Q36.36 |
| 18 | Q25.14 |
| 24 | Q18.94 |
| 36 | Q12.68 |
| Cuotas | Monto |
| 3 (Sin recargo) | Q134.67 |
| 6 (Sin recargo) | Q67.33 |
| 10 (Sin recargo) | Q40.40 |
| 12 (Sin recargo) | Q33.67 |
| 15 (Sin recargo) | Q26.93 |
| 18 (Sin recargo) | Q22.44 |
| 24 | Q18.01 |
| 36 | Q12.01 |
| 48 | Q9.01 |
| Cuotas | Monto |
| 2 (Sin recargo) | Q202.00 |
| 3 (Sin recargo) | Q134.67 |
| 6 | Q71.04 |
| 10 | Q42.82 |
| 12 | Q36.02 |
| 15 | Q29.22 |
| 18 | Q24.80 |
| Cuotas | Monto |
| 2 (Sin recargo) | Q202.00 |
| 3 (Sin recargo) | Q134.67 |
| 6 | Q71.04 |
| 10 | Q42.82 |
| 12 | Q36.02 |
| 15 | Q29.22 |
| 18 | Q24.80 |
| 24 | Q18.94 |
| 36 | Q12.68 |
| 48 | Q9.55 |
| Cuotas | Monto |
| 3 (Sin recargo) | Q134.67 |
| 6 (Sin recargo) | Q67.33 |
| 10 (Sin recargo) | Q40.40 |
| 12 (Sin recargo) | Q33.67 |
| 15 | Q28.55 |
| 18 | Q24.02 |
| 24 | Q18.52 |
| 36 | Q12.79 |
| 48 | Q9.43 |
| Cuotas | Monto |
| 3 (Sin recargo) | Q134.67 |
| 6 | Q71.04 |
| 10 | Q42.82 |
| 12 | Q36.02 |
| 15 | Q29.22 |
| 18 | Q24.80 |
Producto de Tienda Mundial
Ocultar detalles
Producto de importación, vendido por Amazon y transportado desde Miami. Cómpralo hoy y recibe en los próximos 15-22 días hábiles.
- Producto
- Magnetic Planting Tin Platform:Silicone Material,Can with stand high temperature, good heat insulation effect, heat insulation pad has adhesion characteristics, non-slip does not shift.
- Rework Adsorption Silicon Mat:Good Compatibility ,suitable for chip thickness below 0.9mm, most of the current mobile phone chip auxiliary tin planting.
- IC chip soldering insulation pad:Magnetic Positioning,steel mesh magnetic leveling, free hands,Scraping the tin does not move, more evenly.With our single magnet base use, planting tin is more simple and convenient, not easy to drum.
- Tin Planting Pad:Soft And Not Deformed,good resilience, can be curled at will, long-terg use without attenuation deformation.Repair The Tin Pad for iPhone , Android, Mobile BGA chip planting tin.
- Heat Resistant Soldering Mat:Slope Design,Innovative ramp design to make the chip fit better,Compatible with thinner chip ics, pad does not hang more evenly.
* Precio y unidades sujetos a revisión de Pacifiko
100% de Compra Protegida.
Productos originales | Pagos seguros
Productos originales | Pagos seguros
Información del producto
| PID | MDFkMDA2M2 |
| Número de modelo | B0DPHSGFPF |
| Garantía | 7 días sujeto a las políticas de Tienda Mundial |
Garantía y Soporte
Para más información sobre Garantías en Pacifiko visitar la siguiente pagina: Garantías
Política de Igualación de Precios
¿Encontraste este producto más barato en Guatemala? Te igualamos el precio. Aplican condiciones.
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