BSFF Thermal Paste, 1.8g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

BSFF Thermal Paste, 1.8g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

botón compartir redes sociales
Precio:
Q120.00

120.00 - - 0

Producto de Tienda Mundial Ocultar detalles

Producto de importación, vendido por Amazon y transportado desde Miami. Cómpralo hoy y recibe en los próximos 6-14 días hábiles.

  • Producto - Tamaño 1.8G
  • SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
  • BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
  • HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
  • EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
  • EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners

* Precio y unidades sujetos a revisión de Pacifiko
Q120.00

Garantía: Verifica las políticas de Tienda Mundial

100% de Compra Protegida.
Productos originales | Pagos seguros

Información del producto

PID YjE0YTNkOD
Número de modelo B09NJM6C1C
Garantía 7 días sujeto a las políticas de Tienda Mundial

Garantía y Soporte

Para más información sobre Garantías en Pacifiko visitar la siguiente pagina: Garantías

No hay opiniones de clientes